4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Michelle J. Morrell

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Microelectronic assembly including columnar interconnections and

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Microelectronic assembly including polymeric reinforcement on an

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent

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Profile ID: LFUS-PAI-P-1480279

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