Microelectronic assembly including columnar interconnections and

Details Microelectronic assembly including columnar interconnections and Microelectronic assembly including columnar interconnections and

1997-06-16

2000-01-11

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

638614, 638615, H01L 2144

Patent

active

060135719

ABSTRACT:
A microelectronic assembly (10) is formed and includes an integrated circuit component (12) attached to a substrate (14). The integrated circuit component (12) includes metallic columns (24) formed on bond pads (16) on the component (12). A solder plate (30) is formed on each of the metallic columns (24). The integrated circuit component (12) is superposed onto a substrate (14). The substrate (14) includes substrate bond pads (32), and each metallic column (24) registers with a corresponding substrate bond pad (32) such that the solder plate (30) contacts the substrate bond pad (32) to form a preassembly. The preassembly is then heated to reflow the solder plate (30) to form a solder joint (34) between the integrated circuit component (12) and the substrate (14). The solder joint (34) is formed between the solder attachment surface (28) of the metallic column (24) and the substrate bond pad (32).

REFERENCES:
patent: 5130275 (1992-07-01), Dion
patent: 5270253 (1993-12-01), Arai et al.
patent: 5466635 (1995-11-01), Lynch et al.
patent: 5670418 (1997-09-01), Ghosal
patent: 5759910 (1998-06-01), Mangold et al.
patent: 5786238 (1998-07-01), Pai et al.

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