Microelectronic assembly including a decomposable encapsulant, a

Details Microelectronic assembly including a decomposable encapsulant, a Microelectronic assembly including a decomposable encapsulant, a

1996-05-01

1998-10-13

Smith, Jeffrey

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 524, 361760, 525403, H01L 2328

Patent

active

058214569

ABSTRACT:
A microelectronic assembly (10) includes an integrated circuit component (14) spaced apart from a substrate (12) by a gap filled with a polymeric encapsulant (18). The polymeric encapsulant (18) contains a thermally decomposable azide group. In the event that it is necessary to remove the component (14), such as if the component (14) is found to be defective, the microelectronic assembly (10) is heated to a temperature above the decomposition temperature of the azide group. Decomposition of the azide group disintegrates the encapsulant (18) and preferably detaches the component from the substrate (12), thereby permitting replacement of the component (14).

REFERENCES:
patent: 4604644 (1986-08-01), Beckham et al.
patent: 5120678 (1992-06-01), Moore et al.
"Repairability of Underfill Encapsulated Flip-Chip Packages", 45th Electronic Componenets & Technology Conference, May 21-24, 1995.
3M, "GAP-5527 Polyol Brochure", Issued Jun. 1994.
Hawley's Condensed Chemical Dictionary, 1993, p. 108.

Affiliated with

Also associated with

Rating

Microelectronic assembly including a decomposable encapsulant, a does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microelectronic assembly including a decomposable encapsulant, a, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microelectronic assembly including a decomposable encapsulant, a will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-314714