Microelectronic assembly having a perimeter around a MEMS...

Details Microelectronic assembly having a perimeter around a MEMS... Microelectronic assembly having a perimeter around a MEMS...

2007-08-28

2007-08-28

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S691000, C257S737000, C257S773000, C257S776000, C257S788000, C257SE23021, C257SE23069

Reexamination Certificate

active

10843885

ABSTRACT:
A microelectronic assembly is provided having a MEMS substrate, a MEMS device on the MEMS substrate, the MEMS device having a MEMS component which is movable relative to the MEMS substrate, a cover piece having a side over a side of the MEMS substrate on which the MEMS device is located, and a plurality of perimeter components, each having opposing portions sealing with the MEMS substrate and the cover piece respectively, the perimeter components forming a perimeter around the MEMS device.

REFERENCES:
patent: 5591034 (1997-01-01), Ameen et al.
patent: 6144091 (2000-11-01), Washida
patent: 6846725 (2005-01-01), Nagarajan et al.
patent: 6861740 (2005-03-01), Hsu
patent: 2002/0084532 (2002-07-01), Neogi et al.

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