Microelectronic assemblies having low profile connections

Details Microelectronic assemblies having low profile connections Microelectronic assemblies having low profile connections

2006-08-29

2006-08-29

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S460000

Reexamination Certificate

active

07098074

ABSTRACT:
A method is disclosed for making a microelectronic package. A material is applied to a first major surface of a microelectronic element to reduce the heights of protrusions projecting from the first major surface. The microelectronic element is assembled to a microelectronic component. A method of forming protrusions and an assembly incorporating the microelectronic element having protrusions is also disclosed.

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