Microelectromechanical device with integrated conductive shield

Details Microelectromechanical device with integrated conductive shield Microelectromechanical device with integrated conductive shield

2005-10-04

2005-10-04

Kang, Donghee (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C257S414000, C257S417000, C257S419000, C438S050000, C438S051000, C438S052000, C073S715000, C073S718000

Reexamination Certificate

active

06952042

ABSTRACT:
A microelectromechanical device and method of fabricating the same, including a layer of patterned and deposited metal or mechanical-quality, doped polysilicon inserted between the appropriate device element layers, which provides a conductive layer to prevent the microelectromechanical device's output from drifting. The conductive layer may encapsulate of the device's sensing or active elements, or may selectively cover only certain of the device's elements. Further, coupling the metal or mechanical-quality, doped polysilicon to the same voltage source as the device's substrate contact may place the conductive layer at the voltage of the substrate, which may function as a Faraday shield, attracting undesired, migrating ions from interfering with the output of the device.

REFERENCES:
patent: 4463336 (1984-07-01), Black et al.
patent: 4771639 (1988-09-01), Saigusa et al.
patent: 6441451 (2002-08-01), Ikeda et al.
patent: 6465856 (2002-10-01), Gulvin et al.
patent: 09061456 (1997-03-01), None
Stark, B.H. et al., “An Ultra-Thin Hermetic Package Utilizing Electroplated Gold” Tranducers ' 01 Eurosensors XV. 11thInternational Conference On Solid-State Sensors and Actuators. Digest of Technical Papers. Munich, Jun. 10-14, 2001, International Conference On Solid-State Sensors and Actuators. Digest of Technical Papers, BER, vol. 1, Jun. 10, 2001 pp. 194-197, XP002252460. ISBN:3-540-42150-5.

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