Micro individual integrated circuit package

Details Micro individual integrated circuit package Micro individual integrated circuit package

1990-02-20

1991-01-22

Hille, Rolf

357 74, 357 80, 357 79, H01L 2302, H01L 2312, H01L 3902, H01L 2342

Patent

active

049874780

ABSTRACT:
An hermetic integrated circuit package having a single die wherein wire connections to area pads on the active face of the die are carried through an hermetic boundary comprised of a cover plate to an external interface with the next succeeding interconnect level. The package is comprised of a heat exchange element to which the die is attached, a cover plate having holes homologously positioned with respect to the area pads on the die and a seal ring for joining the heat exchange element to the cover plate. The wire connections which are carried through the holes and sealed to the cover plate are externally accessible.

REFERENCES:
patent: 3437883 (1969-04-01), Smith
patent: 4034468 (1977-07-01), Koopman
patent: 4092697 (1978-05-01), Spaight
patent: 4338621 (1982-07-01), Braun
patent: 4479140 (1984-10-01), Horvath
patent: 4612601 (1986-09-01), Watari
patent: 4744007 (1988-05-01), Watari et al.
patent: 4868638 (1989-09-01), Hirata et al.

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