Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Reexamination Certificate
2004-09-29
2009-10-13
Nguyen, Nam X (Department: 1795)
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
C204S192120, C204S192150, C204S192320, C204S298120, C204S298070
Reexamination Certificate
active
07601246
ABSTRACT:
Methods of depositing a protective coating of a silicon-containing or metallic material onto a semiconductor substrate include sputtering such material from an electrode onto a semiconductor substrate in a plasma processing chamber. The protective material can be deposited onto a multi-layer mask overlying a low-k material and/or onto the low-k material. The methods can be used in dual damascene processes to protect the mask and enhance etch selectivity, to protect the low-k material from carbon depletion during resist strip processes, and/or protect the low-k material from absorption of moisture.
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Kim Ji-soo
Loewenhardt Peter
Shon Jong
Yen Biming
Berman Jason M
Buchanan & Ingersoll & Rooney PC
Lam Research Corporation
Nguyen Nam X
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