Cleaning and liquid contact with solids – Processes – With work or work parts movable during treatment
Reexamination Certificate
2005-03-04
2009-11-03
Barr, Michael (Department: 1792)
Cleaning and liquid contact with solids
Processes
With work or work parts movable during treatment
C134S032000, C134S034000
Reexamination Certificate
active
07611589
ABSTRACT:
A method for spin-on wafer cleaning. The method comprises controlling spin speed and vertical water jet pressure. The vertical jet pressure and the spin speed are substantially maintained in inverse proportion. Wafer spin speed is between 50 to 1200 rpm. Vertical wafer jet pressure is between 0.05 to 100 KPa.
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JangJian Shiu-Ko
Jian Yi-An
Lee Wen-Long
Lin Shih-Chi
Lu Dong-Xuan
Barr Michael
Chaudhry Saeed T
Taiwan Semiconductor Manufacturing Co. Ltd.
Thomas Kayden Horstemeyer & Risley
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