Methods of forming power semiconductor devices having...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S138000, C438S270000, C438S589000

Reexamination Certificate

active

07041559

ABSTRACT:
Methods of forming power semiconductor devices include forming a semiconductor substrate having a drift region of first conductivity type therein and a transition region of first conductivity type that extends between the drift region and a first surface of the semiconductor substrate. A gate electrode is formed on the first surface. Base and base shielding region dopants are implanted into the transition region using the gate electrode as an implant mask. A plurality of annealing steps are performed so that the base shielding region dopants are driven in laterally and vertically to substantially their full and final depth within the substrate and thereby define first and second base shielding regions that constrict a neck of the transition region to a minimum width.

REFERENCES:
patent: 4376286 (1983-03-01), Lidow et al.
patent: 4419811 (1983-12-01), Rice
patent: 4590509 (1986-05-01), Esser et al.
patent: 4593302 (1986-06-01), Lidow et al.
patent: 4642666 (1987-02-01), Lidow et al.
patent: 4680853 (1987-07-01), Lidow et al.
patent: 4705759 (1987-11-01), Lidow et al.
patent: 4789882 (1988-12-01), Lidow
patent: 4837606 (1989-06-01), Goodman et al.
patent: 4904614 (1990-02-01), Fisher et al.
patent: 4941026 (1990-07-01), Temple
patent: 4959699 (1990-09-01), Lidow et al.
patent: 4974059 (1990-11-01), Kinzer
patent: 4975751 (1990-12-01), Beasom
patent: 5008725 (1991-04-01), Lidow et al.
patent: 5016066 (1991-05-01), Takahashi
patent: 5023692 (1991-06-01), Wodarczyk
patent: 5079608 (1992-01-01), Wodarczyk
patent: 5095343 (1992-03-01), Klodzinski
patent: 5113236 (1992-05-01), Arnold et al.
patent: 5130767 (1992-07-01), Lidow et al.
patent: 5134321 (1992-07-01), Mehta
patent: 5191396 (1993-03-01), Lidow
patent: 5213986 (1993-05-01), Pinker et al.
patent: 5216807 (1993-06-01), Yoshizawa et al.
patent: 5229633 (1993-07-01), Fisher et al.
patent: 5241195 (1993-08-01), Tu et al.
patent: 5246870 (1993-09-01), Merchant
patent: 5283201 (1994-02-01), Tsang et al.
patent: 5300448 (1994-04-01), Merchant et al.
patent: 5338961 (1994-08-01), Lidow et al.
patent: 5350932 (1994-09-01), Malhi
patent: 5362979 (1994-11-01), Merchant
patent: 5391908 (1995-02-01), Walker et al.
patent: 5399892 (1995-03-01), Neilson
patent: 5412241 (1995-05-01), Merchant
patent: 5445978 (1995-08-01), Yilmaz
patent: 5468668 (1995-11-01), Neilson
patent: 5497285 (1996-03-01), Nadd
patent: 5545908 (1996-08-01), Tokura et al.
patent: 5578508 (1996-11-01), Baba et al.
patent: 5598018 (1997-01-01), Lidow
patent: 5623152 (1997-04-01), Majumdar et al.
patent: 5640034 (1997-06-01), Malhi
patent: 5648671 (1997-07-01), Merchant
patent: 5661314 (1997-08-01), Merrill
patent: 5672526 (1997-09-01), Kawamura
patent: 5684319 (1997-11-01), Hebert
patent: 5701026 (1997-12-01), Fujishima et al.
patent: 5710451 (1998-01-01), Merchant
patent: 5710455 (1998-01-01), Bhatnagar et al.
patent: 5731604 (1998-03-01), Kinzer
patent: 5742087 (1998-04-01), Lidow
patent: 5766966 (1998-06-01), Ng
patent: 5767547 (1998-06-01), Merchant et al.
patent: 5844275 (1998-12-01), Kitamura et al.
patent: 5879967 (1999-03-01), Kim
patent: 5885878 (1999-03-01), Fujishima et al.
patent: 5904510 (1999-05-01), Merrill et al.
patent: 5918137 (1999-06-01), Ng et al.
patent: 5973360 (1999-10-01), Tihanyi
patent: 5973368 (1999-10-01), Pearce et al.
patent: 5998833 (1999-12-01), Baliga
patent: 6043126 (2000-03-01), Kinzer
patent: 6104062 (2000-08-01), Zeng
patent: 6114726 (2000-09-01), Barkhordarian
patent: 6127746 (2000-10-01), Clemente
patent: 6194773 (2001-02-01), Malhi
patent: 6201279 (2002-03-01), Pfirsch
patent: 6441408 (2002-08-01), Porst
patent: 6452230 (2002-09-01), Boden, Jr.
patent: 6459142 (2002-10-01), Tihanyi
patent: 6144065 (2002-11-01), Kinzer
patent: 6486524 (2002-11-01), Ahmed
patent: 6503786 (2003-01-01), Klodzinski
patent: 6509721 (2003-01-01), Liebler
patent: 6521962 (2003-02-01), Evans
patent: 6524900 (2003-02-01), Dahlqvist et al.
patent: 6525383 (2003-02-01), Stecher
patent: 6534836 (2003-03-01), Osanai
patent: 6541820 (2003-04-01), Bol
patent: 6603153 (2003-08-01), Francis et al.
patent: 6617642 (2003-09-01), Georgescu
patent: 6621107 (2003-09-01), Blanchard et al.
patent: 6649975 (2003-11-01), Baliga
patent: 6673662 (2004-01-01), Singh
patent: 6674123 (2004-01-01), Kim
patent: 6696772 (2004-02-01), Nieminen
patent: 6707101 (2004-03-01), Ranjan
patent: 2003/0020133 (2003-01-01), Dahlqvist et al.
patent: 2004/0046224 (2004-03-01), Rossel et al.
patent: 2004/0080010 (2004-04-01), Parikh et al.
patent: 195 34 154 (1997-03-01), None
patent: 63-296282 (1988-02-01), None
patent: 03132077 (1991-05-01), None
patent: WO 99/56311 (1999-11-01), None
patent: WO 00/44031 (2000-07-01), None
Baliga et al.,Paradigm Shift in Planar Power MOSFET Technology,Power Electronics Technology, Nov. 2003, pp. 24-32.
Baliga, B. Jayant, “Power Semiconductor Devices,” PWS Publishing Co., ISBN 0-534-04098-6, 1995, pp. 335-425.
International Search Report, PCT/US02/12775, Apr. 4, 2003.
Merchant et al., “Dependence of Breakdown Voltage on Drift Length and Buried Oxide Thickness in SOI RESURF LDMOS Transistors,” 5thInternational Symposium on Power Semiconductor Devices and Ics, 1993 IEEE, pp. 124-128.
Merchant et al., “Realization of High Breakdown Voltage (>700 V) in This SOI Devices,” Philips Laboratories, North American Philips Corporation, 1991 IEEE, pp. 31-35.
Sunkavalli et al., “Step Drift Doping Profile for High Voltage DI Lateral Power Devices,” Proceedings 1995 IEEE International SOI Conference, Oct. 1995, pp. 139-140.
Yamaguchi, Ken, “Field-Dependent Mobility Model for Two-Dimensional Numerical Analysis of MOSFET's,” IEEE Transactions on Electron Devices, vol. ED-26, No. 7, Jul. 1979, pp. 1068-1074.

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