Methods of forming field effect transistors and field effect...

Details Methods of forming field effect transistors and field effect... Methods of forming field effect transistors and field effect...

1998-02-27

2001-08-07

Trinh, Michael (Department: 2822)

Semiconductor device manufacturing: process

Making field effect device having pair of active regions...

Having insulated gate

C438S237000, C438S238000, C438S586000

Reexamination Certificate

active

06271067

ABSTRACT:

TECHNICAL FIELD
This invention relates to methods of forming field effect transistors, and to field effect transistor circuitry.
BACKGROUND OF THE INVENTION
It is desirable in transistors to be able to drive high currents. Driving high currents can enhance a transistor's operating performance including its operating speed. In field effect transistors (FETs), current ii flow is primarily conducted by way of the drain-to-source current I
ds
. While higher drive currents can be achieved by building wider FET devices, tradeoffs are made in valuable wafer real estate. Larger devices also typically have larger capacitances which can adversely impact device performance. Also typically, a high I
ds
current in FET devices can result in an increased sub-threshold current leakage. It is desirable in FETs to minimize the sub-threshold current leakage. Accordingly, it is desirable to have the I
ds
ratio of on-state current (I
on
) to off-state current (I
off
) be as high as possible. Such improves sub-threshold device leakage characteristics as well as increases the transistor's operating speed performance.
This invention arose out of concerns associated with improving field effect transistor performance.
SUMMARY OF THE INVENTION
Methods of forming field effect transistors and resultant field effect transistor circuitry are described. In one embodiment, a semiconductive substrate includes a field effect transistor having a body. A first resistive element is received by the substrate and connected between the transistor's gate and the body. A second resistive element is received by the substrate and connected between the body and a reference voltage node. The first and second resistive elements form a voltage divider which is configured to selectively change threshold voltages of the field effect transistor with state changes in the gate voltage. In a preferred embodiment, first and second diode assemblies are positioned over the substrate and connected between the gate and body, and the body and a reference voltage node to provide the voltage divider.


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Solid State Electronic Devices, by Benjamin G.Streetman, Prentice-Hall 1972, pp. 293-300.
Physics of Semiconductor Devices, by Simon M. Sze, Wiley-Interscience 1969, pp. 505-512.

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