Methods of forming conductive interconnects, and methods of...

Details Methods of forming conductive interconnects, and methods of... Methods of forming conductive interconnects, and methods of...

2005-08-23

2005-08-23

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S675000

Reexamination Certificate

active

06933231

ABSTRACT:
The invention includes methods of electroless plating of nickel selectively on exposed conductive surfaces relative to exposed insulative surfaces. The electroless plating can utilize a bath which contains triethanolamine, maleic anhydride and at least one nickel salt.

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Catherine et al.,ASM Handbood “Surface Engineering”, vol. 5, pp. 290-310, 1984.
Kondo et al., “Acceleration of Electroless Copper Deposition in the Presence of Excess Triethanolamine,” The Electrochemical Society, Inc., © 1991. pp. 3629-3633.

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