Semiconductor device manufacturing: process – Making passive device – Stacked capacitor
Patent
1997-10-07
2000-02-15
Whitehead, Jr., Carl
Semiconductor device manufacturing: process
Making passive device
Stacked capacitor
438253, 438255, 438396, 438947, 438964, H01L 218242
Patent
active
060252480
ABSTRACT:
A method of forming a capacitor includes the step of forming an electrode on an integrated circuit substrate wherein the electrode covers a first portion of the integrated circuit substrate and wherein the electrode exposes a second portion of the integrated circuit substrate. An etch masking pattern including a plurality of ions is formed on the surface of the electrode wherein the etch masking pattern exposes portions of the surface of the electrode. The exposed portions of the electrode are etched using the etch masking pattern as an etching mask so that recesses are formed in the surface of the electrode thereby increasing a surface area thereof. The etch masking pattern is removed, a dielectric layer is formed on the electrode including the recesses, and a conductive layer is formed on the dielectric layer opposite the electrode.
REFERENCES:
patent: 5134086 (1992-07-01), Ahn
patent: 5350707 (1994-09-01), Ko et al.
patent: 5492848 (1996-02-01), Lur et al.
patent: 5670407 (1997-09-01), Tseng
patent: 5681774 (1997-10-01), Tseng
Kim Hee-seok
Lee Jae-chul
Lee Jae-hyong
Lim Hyun-woo
Jr. Carl Whitehead
Samsung Electronics Co,. Ltd.
Thomas Toniae M.
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