Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Having light transmissive window
Reexamination Certificate
2007-01-30
2007-01-30
Pert, Evan (Department: 2826)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Having light transmissive window
Reexamination Certificate
active
11118498
ABSTRACT:
Packaging assemblies for optically interactive devices and methods of forming the packaging assemblies in an efficient manner that eliminates or reduces the occurrence of process contaminants. In a first embodiment, a transparent cover is attached to a wafer of semiconductor material containing a plurality of optically interactive devices. The wafer is singulated, and the optically interactive devices are mounted on an interposer and electrically connected with wire bonds. In a second embodiment, the optically interactive devices are electrically connected to the interposer with back side conductive elements. In a third embodiment, the optically interactive devices are mounted to the interposer prior to attaching a transparent cover. A layer of encapsulant material is formed over the interposer, and the interposer and encapsulant material are cut to provide individual packaging assemblies. In a fourth embodiment, the optically interactive devices are mounted in a preformed leadless chip carrier.
REFERENCES:
patent: 4418284 (1983-11-01), Ogawa et al.
patent: 5433911 (1995-07-01), Ozimek et al.
patent: 5753857 (1998-05-01), Choi
patent: 5811799 (1998-09-01), Wu
patent: 5865935 (1999-02-01), Ozimek et al.
patent: 6011294 (2000-01-01), Wetzel
patent: 6143588 (2000-11-01), Glenn
patent: 6266197 (2001-07-01), Glenn et al.
patent: 6285064 (2001-09-01), Foster
patent: 6351027 (2002-02-01), Giiboney et al.
patent: 6358773 (2002-03-01), Lin et al.
patent: 6428650 (2002-08-01), Chung
patent: 6509560 (2003-01-01), Glenn et al.
patent: 6534340 (2003-03-01), Karpman et al.
patent: 6603183 (2003-08-01), Hoffman
patent: 6753203 (2004-06-01), Dai
patent: 6762492 (2004-07-01), Nakajima et al.
patent: 6822326 (2004-11-01), Enquist et al.
patent: 6856014 (2005-02-01), Ehmke et al.
patent: 6874227 (2005-04-01), Hsin et al.
patent: 6900531 (2005-05-01), Foong et al.
patent: 6905910 (2005-06-01), Shiu et al.
patent: 2004/0164981 (2004-08-01), Fujita et al.
Bolken Todd O.
Cobbley Chad A.
Micro)n Technology, Inc.
Pert Evan
TraskBritt
LandOfFree
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