Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-03-13
2007-03-13
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S644000, C438S647000, C438S675000, C257SE21585
Reexamination Certificate
active
10920482
ABSTRACT:
A method forming a tungsten contact can include forming a contact hole in an interlayer dielectric layer to expose a portion of an underlying silicon based substrate and to form a side wall of the contact hole. A tungsten silicide layer can be formed on at least on the exposed portion of the substrate. A tungsten nitride layer can be conformally formed on a surface of the interlayer dielectric layer, on the tungsten silicide layer and on the side wall. A contact tungsten layer can be formed on the tungsten nitride layer to fill the contact hole. Related apparatus and contacts are also disclosed.
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Notice to File a Response/Amendment to the Examination Report for Korean patent application 10-2003-0057264 mailed on Jul. 11, 2005.
Choi Gil-Heyun
Choi Kyung-In
Lee Jong-Myeong
Lee Sang-Woo
Lebentritt Michael
Lee Cheung
Myers Bigel & Sibley Sajovec, PA
Samsung Electronics Co,. Ltd.
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