Methods of fabricating integrated circuit devices providing...

Details Methods of fabricating integrated circuit devices providing... Methods of fabricating integrated circuit devices providing...

2005-10-11

2005-10-11

Wilczewski, Mary (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S256000, C438S399000, C438S586000, C438S638000, C438S639000, C438S672000, C438S696000, C438S739000

Reexamination Certificate

active

06953744

ABSTRACT:
The present invention provides methods of fabricating integrated circuit devices that include a microelectronic substrate and a conductive layer disposed on the microelectronic substrate. An insulating layer is disposed on the conductive layer and the insulating layer includes an overhanging portion that extends beyond the conductive layer. A sidewall insulating region is disposed laterally adjacent to a sidewall of the conductive layer and extends between the overhanging portion of the insulating layer and the microelectronic substrate.

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