Methods of depositing materials over substrates, and methods...

Coating processes – Coating by vapor – gas – or smoke

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C427S255700, C427S252000, C427S255320, C427S901000, C427S255310, C427S255360

Reexamination Certificate

active

07544388

ABSTRACT:
The invention includes methods of utilizing supercritical fluids to introduce precursors into reaction chambers. In some aspects, a supercritical fluid is utilized to introduce at least one precursor into a chamber during ALD, and in particular aspects the supercritical fluid is utilized to introduce multiple precursors into the reaction chamber during ALD. The invention can be utilized to form any of various materials, including metal-containing materials, such as, for example, metal oxides, metal nitrides, and materials consisting of metal. Metal oxides can be formed by utilizing a supercritical fluid can be utilized to introduce a metal-containing precursor into reaction chamber, with the precursor then forming a metal-containing layer over a surface of a substrate. Subsequently, the metal-containing layer can be reacted with oxygen to convert at least some of the metal within the layer to metal oxide.

REFERENCES:
patent: 4737384 (1988-04-01), Murthy et al.
patent: 4970093 (1990-11-01), Sievers et al.
patent: 5403621 (1995-04-01), Jackson et al.
patent: 5789027 (1998-08-01), Watkins et al.
patent: 6348376 (2002-02-01), Lim et al.
patent: 6531224 (2003-03-01), Fryxell et al.
patent: 6576345 (2003-06-01), Van Cleemput et al.
patent: 6579345 (2003-06-01), Munari et al.
patent: 6689700 (2004-02-01), Watkins et al.
patent: 6835664 (2004-12-01), Sarigiannis et al.
patent: 6869876 (2005-03-01), Norman et al.
patent: 6951765 (2005-10-01), Gopinath et al.
patent: 2002/0090458 (2002-07-01), Cotte et al.
patent: 2002/0115275 (2002-08-01), Choi
patent: 2002/0164419 (2002-11-01), Fukushima et al.
patent: 2003/0143841 (2003-07-01), Yang et al.
patent: 2003/0183938 (2003-10-01), Wai et al.
patent: 2004/0001943 (2004-01-01), Alford et al.
patent: 2004/0023453 (2004-02-01), Xu et al.
patent: 2004/0146636 (2004-07-01), DeYoung et al.
patent: 2005/0181613 (2005-08-01), Xu et al.
patent: 1024524 (2000-01-01), None
patent: 2002-001122 (1990-05-01), None
patent: 2003-213425 (2003-07-01), None
patent: 2004-025084 (2004-01-01), None
patent: 2004-156141 (2004-06-01), None
patent: WO 03/106011 (2003-12-01), None
patent: WO2004/041753 (2004-05-01), None
patent: PCT/US2004/025804 (2004-08-01), None
Zemanian, Thomas S., “Chemical Functionalization of Nanostructrued Materials Using Supercritical Reaction Media” IEEE-NANO, Oct. 29, 2001, pp. 288-292.
Blackburn, Jason M., “Deposition of Conformal Copper and Nickel Films from Supercritical Carbon Dioxide” Science, vol. 294, Oct. 5, 2001, pp. 141-145.
Long, David P., “Chemical Fluid Deposition: A Hybrid Technique for Low-Temperature Metallization” Advanced Materials 2000, 12, No. 12, Weinheim 2000, pp. 913-915.
Mocella, Michael T., “Fluorinated compounds for advanced IC interconnect applications: a survey of chemistries and processes” Journal of Fluorine Chemistry, Elsevier Science B.V., 2003.
Cabanas, Albertina, et al. “Deposition of Cu flms from supercritical fluids using Cu(1) β-diketonate precursors” Elsivier, Microelectric Engineering, 64 (2202) pp. 53-61.
Fernandes, Neil E., et al. “Reactive Deposition of Metal Thin Films within Porous Supports from Supercritical Fluids” 2001 American Chemical Society, Chem. Mater. 201, 13, pp. 2023-2031.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Methods of depositing materials over substrates, and methods... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods of depositing materials over substrates, and methods..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of depositing materials over substrates, and methods... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4120762

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.