Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate
2008-07-02
2010-11-02
Booth, Richard A. (Department: 2812)
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
C257SE21008
Reexamination Certificate
active
07824935
ABSTRACT:
In embodiments of the current invention, methods of combinatorial processing and a test chip for use in these methods are described. These methods and test chips enable the efficient development of materials, processes, and process sequence integration schemes for semiconductor manufacturing processes. In general, the methods simplify the processing sequence of forming devices or partially formed devices on a test chip such that the devices can be tested immediately after formation. The immediate testing allows for the high throughput testing of varied materials, processes, or process sequences on the test chip. The test chip has multiple site isolated regions where each of the regions is varied from one another and the test chip is designed to enable high throughput testing of the different regions.
REFERENCES:
patent: 2007/0202614 (2007-08-01), Chiang et al.
patent: 2009/0155936 (2009-06-01), Weiner et al.
Chiang Tony
Hashim Imran
Malhotra Sandra
Phatak Prashant
Verma Gaurav
Booth Richard A.
Intermolecular, Inc.
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