Methods of and apparatus for pre-planarizing a substrate

Details Methods of and apparatus for pre-planarizing a substrate Methods of and apparatus for pre-planarizing a substrate

2006-08-15

2006-08-15

Ackun, Jr., Jacob K. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With indicating

C451S177000, C451S506000

Reexamination Certificate

active

07090562

ABSTRACT:
Methods and apparatus are provided to provide a substantially uniform layer thickness above a wafer contour as the wafer rotates and is traversed past a pre-planarization tool. The tool has a shank defining an axis of rotation, and a planarization member coupled to the shank has a hook-shaped section supporting a pre-planarization surface spaced by an at-rest-distance from the axis of during an at-rest condition of the shank. The hook-shaped section has a modulus of elasticity selected so that upon rotation, the hook-shaped section flexes and moves the pre-planarization surface to rotation-distances spaced from the axis in response to a velocity of rotation of the hook-shaped section around the axis in a range of velocities. As the tool rotates, metrology intermittently directly senses the layer thickness and controls the velocity of rotation so the rotation-distances have values in excess of a value of the at-rest-distance.

REFERENCES:
patent: 2938309 (1960-05-01), Pollet
patent: 3735535 (1973-05-01), Waller
patent: 3905080 (1975-09-01), Bond
patent: 6254467 (2001-07-01), Prosl

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