Abrading – Precision device or process - or with condition responsive... – Computer controlled
Reexamination Certificate
2006-05-09
2006-05-09
Rose, Robert A. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
Computer controlled
C451S056000
Reexamination Certificate
active
07040954
ABSTRACT:
Apparatus and methods control CMP to uniformly polish a series of wafers. Average motor current I(avg) drawn by, and related average work W(avg) performed by, motors during CMP on the wafers reliably indicate quality of a roughness polishing characteristic of a polishing surface of a polishing pad. A conditioner controller controls a rate at which the quality of the polishing surface is restored by conditioning in relation to a rate of change of the quality of the polishing surface due to the CMP. Motor current is measured and averaged over many CMP-processed wafers. The method defines a baseline range of values of average work and controls conditioning according to whether average work is within the baseline range. When the polishing surface moves at constant velocity relative to each of the wafers that are being polished, a control signal based on average motor current represents the quality of the polishing characteristic.
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McClatchie Simon
Norton Peter
Pham Xuyen
Zhou Ren
Lam Research Corporation
Martine & Penilla & Gencarella LLP
Rose Robert A.
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