Methods for removing stringers appearing in copper-containing mu

Details Methods for removing stringers appearing in copper-containing mu Methods for removing stringers appearing in copper-containing mu

1988-02-08

1991-09-17

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 156666, 156901, 156902, 252 792, 252 793, 252 794, 427 97, 427309, C23F 100

Patent

active

050492349

ABSTRACT:
Copper-containing multilayer substrates are etched, and stringers formed in the plated through-holes in these substrates are simultaneously removed by treatment with an aqueous composition including about 37% by weight hydrofluoric acid and about 16% by weight nitric acid. The same aqueous composition can be used to remove stringers formed during treatment of such substrates with other etchants.

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patent: 4345969 (1982-08-01), James et al.
patent: 4425210 (1984-01-01), Fazlin
patent: 4541035 (1985-09-01), Carlson et al.
patent: 4546374 (1985-10-01), Olsen et al.
patent: 4615907 (1986-10-01), Boeke et al.
patent: 4631805 (1986-12-01), Olsen et al.
patent: 4657632 (1987-04-01), Holtzman et al.
patent: 4695348 (1987-09-01), Battey et al.

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