Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Patent
1997-12-18
2000-07-11
Utech, Benjamin L.
Semiconductor device manufacturing: process
Chemical etching
Liquid phase etching
438706, 438749, 438750, H01L 21283
Patent
active
060872713
ABSTRACT:
A method is provided for removing an bottom anti-reflective coating (BARC) from a transistor gate following at least one etch back process associated with a spacer formation and/or subsequent resistor protect etching process or processes. The method eliminates the need to use HF acid in the stripping process by substantially reducing the thickness of the BARC during each of the etching back processes, such that, only a thin layer of BARC material remains that can be easily removed with phosphoric acid.
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S. Wolf, Silicon Processing for the VLSI Era, vol. 1, chapter 15: Wet Etching, Cleaning and Lift-off, pp. 516,518.
Chan Maria Chow
En William G.
Karlsson Olov B.
Lyons Christopher F.
Ngo Minh Van
Advanced Micro Devices , Inc.
Utech Benjamin L.
Vinh Lan
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