Methods for removal of an anti-reflective coating following a re

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching

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438706, 438749, 438750, H01L 21283

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active

060872713

ABSTRACT:
A method is provided for removing an bottom anti-reflective coating (BARC) from a transistor gate following at least one etch back process associated with a spacer formation and/or subsequent resistor protect etching process or processes. The method eliminates the need to use HF acid in the stripping process by substantially reducing the thickness of the BARC during each of the etching back processes, such that, only a thin layer of BARC material remains that can be easily removed with phosphoric acid.

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patent: 5911887 (1999-06-01), Smith et al.
S. Wolf, Silicon Processing for the VLSI Era, vol. 1, chapter 15: Wet Etching, Cleaning and Lift-off, pp. 516,518.

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