Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-09-19
2006-09-19
Nguyen, Tuan H. (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S780000
Reexamination Certificate
active
07109106
ABSTRACT:
Methods of fabricating and disposing supports around contact pads of semiconductor device components and other substrates include use of stereolithographic techniques. The supports may be preformed structures which are attached to a surface of a semiconductor device component or other substrate. Alternatively, the supports may be fabricated on the surface of the semiconductor device or other substrate. One or more of the supports may be positioned around the contact pads of a semiconductor device component or other substrate before or after solder balls are secured to the contact pads. Upon reflowing the solder balls to connect the semiconductor device face-down to a higher level substrate, the supports prevent the reflowed solder from contacting regions of the surface of the semiconductor device that surround the contact pads thereof.
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Micro)n Technology, Inc.
Nguyen Tuan H.
TraskBritt
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