Methods for providing improved layer adhesion in a...

Details Methods for providing improved layer adhesion in a... Methods for providing improved layer adhesion in a...

2005-08-09

2005-08-09

Wilson, Christian (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S625000, C438S642000, C438S644000

Reexamination Certificate

active

06927159

ABSTRACT:
According to one embodiment of the invention, a method for providing improved layer adhesion in a semiconductor is provided. The method includes forming a dielectric layer. The method also includes forming a layer of metal in direct contact with the dielectric layer. The method also includes directly exposing the layer of metal, after forming the layer of metal, to plasma at a power level sufficient to penetrate through the layer of metal and reach the dielectric layer.

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