Methods for priming wafers employed in integrated circuit device

Details Methods for priming wafers employed in integrated circuit device Methods for priming wafers employed in integrated circuit device

1998-01-05

2000-06-13

Nelms, David

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438680, 438681, 438780, 438789, 438790, H01L 2144

Patent

active

06074944&

ABSTRACT:
Methods of treating surfaces of wafers to be used in forming integrated circuit devices comprise applying dihydropyrane to the surfaces of the wafers wherein hydrophobicity is imparted to the surfaces. The applying steps are carried out prior to applying photoresists to the wafers.

REFERENCES:
patent: 5565304 (1996-10-01), Honda
patent: 6033826 (2000-03-01), Urano et al.

Affiliated with

Also associated with

Rating

Methods for priming wafers employed in integrated circuit device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods for priming wafers employed in integrated circuit device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for priming wafers employed in integrated circuit device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2068310