Methods for planarizing unevenness on surface of wafer...

Details Methods for planarizing unevenness on surface of wafer... Methods for planarizing unevenness on surface of wafer...

2008-04-10

2011-12-06

Duda, Kathleen (Department: 1722)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

Reexamination Certificate

active

08071275

ABSTRACT:
A wafer has a substrate and a photoresist layer thereon with a surface that is planarized by positioning over a starting surface of the photoresist layer a gray-scale mask having a pattern that correlates with a gradient height profile of unevenness present on the starting surface, patterning the photoresist layer using the gray-scale mask to produce the pattern thereof in the photoresist layer which, in effect, produces a profile of evenness in the photoresist layer underlying the gradient height profile of unevenness, and developing the patterned photoresist layer such that only a three-dimensional portion thereof corresponding to the gradient height profile of unevenness located above the profile of evenness is removed which, in effect, leaves behind a resulting surface on the photoresist layer made substantially more even and thus substantially in a planarized condition.

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C.M. Waits et al., “Microfabrication of 3D silicon MEMS structures using gray-scale lithography and deep reactive ion etching”, Sensors and Actuators A, 119 (2005) 245-253.

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