Methods for packaging image sensitive electronic devices

Details Methods for packaging image sensitive electronic devices Methods for packaging image sensitive electronic devices

2007-03-27

2007-03-27

Graybill, David E. (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Having diverse electrical device

C438S026000, C438S027000, C438S029000, C438S106000, C438S107000, C438S108000, C438S116000, C438S126000, C438S127000, C438S125000

Reexamination Certificate

active

10370674

ABSTRACT:
The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a barrier of transfer mold compound and covering the chip with a transparent lid. In another embodiment of the invention, the perimeter area of a chip, including interconnections such as wire bonds and bond pads, is encapsulated with a liquid dispensed epoxy, and a transparent lid is attached. In yet another embodiment of the invention, chip encapsulation is accomplished with a unitary shell of entirely transparent material. In yet another embodiment of the invention, a substrate-mounted chip and a transparent lid are loaded into a transfer mold that holds them in optimal alignment. The transfer mold is then filled with molding compound to encapsulate the chip and interconnections, and to retain the transparent lid.

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