Methods for nanoscale feature imprint molding

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C977S887000, C977S888000, C257SE21561

Reexamination Certificate

active

07736954

ABSTRACT:
Methods for fabricating nanoscale features are disclosed. One technique involves depositing onto a substrate, where the first layer may be a silicon layer and may subsequently be etched. A second layer and third layer may be deposited on the etch first layer, followed by the deposition of a silicon cap. The second and third layer may be etched, exposing edges of the second and third layers. The cap and first layer may be removed and either the second or third layer may be etched, creating a nanoscale pattern.

REFERENCES:
patent: 7344961 (2008-03-01), Romano et al.
patent: 2007/0243655 (2007-10-01), Schmid et al.
“Silicon Processing for the VLSI Era,” vol. 1, 2000.
Cho et al., “Hf-silicate inter-poly dielectic technology for sub 70nm body tied FinFET flash memory,”2005 Symposium on VLSI Technology Digest of Technical Papers, 208-209, 2005.
Liu et al., “Electron mobility in multi-FinFET with a (111) channel surface fabricated by orientation-dependent wet etching.”Microeletronic Engineering, 80:390-393, 2005.
Oh et al., “Damascene gate FinFET SONOS memory implemented on bulk silicon wafer,”Electron Devices Meeting, IEDM Technical Digest, IEEE International, 893-896, 2004.
Ohkura et al., Beam-induced seeded lateral epitaxy with suppressed impurity diffusion for a three-dimensional DRAM cell fabrication,IEEE Transactions on Electron Devices, 36:333-339, 1989.
Xiong et al., “Improvement of FinFET electrical characteristics by hydrogen annealing,”Electron Device Letters, IEEE, 25:541-543, 2004.

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