Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate
Reexamination Certificate
2011-02-15
2011-02-15
Smith, Zandra (Department: 2822)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
By reaction with substrate
C438S766000
Reexamination Certificate
active
07888272
ABSTRACT:
A semiconductor fabrication process allows the fabrication of both logic and memory devices using a conventional CMOS process with a few additional steps. The additional steps, however, do not require additional masks. Accordingly, the process can be reduce the complexity, time, and cost for fabricating logic and memory devices on the same substrate, especially for embedded applications.
REFERENCES:
patent: 5596218 (1997-01-01), Soleimani et al.
patent: 6277689 (2001-08-01), Wong
patent: 6545314 (2003-04-01), Forbes et al.
patent: 6800830 (2004-10-01), Mahawili
patent: 6885587 (2005-04-01), Yang et al.
Chen Kuan Fu
Chen Ming-Shang
Chen Yin Jen
Han Tzung Ting
Lee Shih Chin
Baker & McKenzie LLP
Macronix International Co. Ltd.
Perkins Pamela E
Smith Zandra
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