Methods for making reinforced wafer polishing pads and...

Details Methods for making reinforced wafer polishing pads and... Methods for making reinforced wafer polishing pads and...

2005-09-27

2005-09-27

Nguyen, Dung Van (Department: 3723)

Abrading

Flexible-member tool, per se

Laminate

C451S526000

Reexamination Certificate

active

06949020

ABSTRACT:
As one of many embodiments of the present invention, a seamless polishing apparatus for utilization in chemical mechanical polishing is provided. The seamless polishing apparatus includes a polishing pad where the polishing pad is shaped like a belt and has no seams. The seamless polishing apparatus also includes a base belt where the base belt includes a reinforcement layer where the reinforcement layer is a fibrous-type material. In addition, the polishing pad is located over the base belt.

REFERENCES:
patent: 5482756 (1996-01-01), Berger et al.
patent: 5681612 (1997-10-01), Benedict et al.
patent: 5810964 (1998-09-01), Shiraishi
patent: 6561889 (2003-05-01), Xu et al.
patent: 6572463 (2003-06-01), Xu et al.
patent: 6575821 (2003-06-01), Jöst
patent: 6736714 (2004-05-01), Dudovicz

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