Methods for in-situ removal of an anti-reflective coating during

Semiconductor device manufacturing: process – Making field effect device having pair of active regions...

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438184, 438230, 438723, 216 79, H01L 21335

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active

060279591

ABSTRACT:
A method is provided for removing an bottom anti-reflective coating (BARC) from a transistor gate during an etch back process associated with a nitride resistor protect etch process. The method includes removing a silicon oxynitride BARC, in-situ, during an oxide resistor protect etching process using a plasma formed with CF.sub.4 gas, CHF.sub.3 gas, O.sub.2 gas, and Argon (Ar) gas.

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