Methods for forming moisture blocking layers

Details Methods for forming moisture blocking layers Methods for forming moisture blocking layers

1997-03-27

1999-02-02

Bowers, Charles

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

433763, H01L 71316

Patent

active

058664769

ABSTRACT:
A method for forming an insulating layer for a microelectronic device includes the steps of forming a conductive pattern on a surface of a microelectronic substrate, and forming a spin-on-glass layer on the surface of the microelectronic substrate covering the conductive pattern. The spin-on-glass layer is baked at a temperature in the range of 400.degree. C. to 750.degree. C., and a moisture blocking layer is formed on the baked spin-on-glass layer. By reducing moisture absorbed from the air into the spin-on-glass layer, a relatively low etch rate and a relatively low dielectric constant can be maintained for the spin-on-glass layer. Related structures are also discussed.

REFERENCES:
patent: 5003062 (1991-03-01), Yen
patent: 5192697 (1993-03-01), Leong
patent: 5270259 (1993-12-01), Ito et al.
patent: 5286681 (1994-02-01), Maeda et al.
patent: 5290399 (1994-03-01), Reinhardt
patent: 5376590 (1994-12-01), Machida et al.
patent: 5429990 (1995-07-01), Liu et al.
patent: 5432073 (1995-07-01), Wu et al.
patent: 5457073 (1995-10-01), Ouellet
patent: 5496776 (1996-03-01), Chien et al.
patent: 5506177 (1996-04-01), Kishimoto et al.
patent: 5663108 (1997-09-01), Lin

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