Methods for fabricating strained layers on semiconductor...

Details Methods for fabricating strained layers on semiconductor... Methods for fabricating strained layers on semiconductor...

2007-08-21

2007-08-21

Kebede, Brook (Department: 2823)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

By reaction with substrate

Reexamination Certificate

active

11362892

ABSTRACT:
Methods for fabricating multi-layer semiconductor structures including strained material layers using a minimum number of process tools and under conditions optimized for each layer. Certain regions of the strained material layers are kept free of impurities that can interdiffuse from adjacent portions of the semiconductor. When impurities are present in certain regions of the strained material layers, there is degradation in device performance. By employing semiconductor structures and devices (e.g., field effect transistors or “FETs”) that have the features described, or are fabricated in accordance with the steps described, device operation is enhanced.

REFERENCES:
patent: 4010045 (1977-03-01), Ruehrwein
patent: 4710788 (1987-12-01), Dambkes et al.
patent: 4990979 (1991-02-01), Otto
patent: 4997776 (1991-03-01), Harame et al.
patent: 5013681 (1991-05-01), Godbey et al.
patent: 5155571 (1992-10-01), Wang et al.
patent: 5166084 (1992-11-01), Pfiester
patent: 5177583 (1993-01-01), Endo et al.
patent: 5202284 (1993-04-01), Kamins et al.
patent: 5207864 (1993-05-01), Bhat et al.
patent: 5208182 (1993-05-01), Narayan et al.
patent: 5212110 (1993-05-01), Pfiester et al.
patent: 5221413 (1993-06-01), Brasen et al.
patent: 5241197 (1993-08-01), Murakami et al.
patent: 5250445 (1993-10-01), Bean et al.
patent: 5285086 (1994-02-01), Fitzgerald, Jr.
patent: 5291439 (1994-03-01), Kauffmann et al.
patent: 5298452 (1994-03-01), Meyerson
patent: 5310451 (1994-05-01), Tejwani et al.
patent: 5316958 (1994-05-01), Meyerson
patent: 5346848 (1994-09-01), Grupen-Shemansky et al.
patent: 5374564 (1994-12-01), Bruel
patent: 5399522 (1995-03-01), Ohori
patent: 5413679 (1995-05-01), Godbey
patent: 5426069 (1995-06-01), Selvakumar et al.
patent: 5426316 (1995-06-01), Mohammad
patent: 5442205 (1995-08-01), Brasen et al.
patent: 5461243 (1995-10-01), Ek et al.
patent: 5461250 (1995-10-01), Burghartz et al.
patent: 5462883 (1995-10-01), Dennard et al.
patent: 5476813 (1995-12-01), Naruse
patent: 5479033 (1995-12-01), Baca et al.
patent: 5484664 (1996-01-01), Kitahara et al.
patent: 5523243 (1996-06-01), Mohammad
patent: 5523592 (1996-06-01), Nakagawa et al.
patent: 5534713 (1996-07-01), Ismail et al.
patent: 5536361 (1996-07-01), Kondo et al.
patent: 5540785 (1996-07-01), Dennard et al.
patent: 5596527 (1997-01-01), Tomioka et al.
patent: 5617351 (1997-04-01), Bertin et al.
patent: 5630905 (1997-05-01), Lynch et al.
patent: 5659187 (1997-08-01), Legoues et al.
patent: 5683934 (1997-11-01), Candelaria
patent: 5698869 (1997-12-01), Yoshimi et al.
patent: 5714777 (1998-02-01), Ismail et al.
patent: 5728623 (1998-03-01), Mori
patent: 5739567 (1998-04-01), Wong
patent: 5759898 (1998-06-01), Ek et al.
patent: 5777347 (1998-07-01), Bartelink
patent: 5786612 (1998-07-01), Otani et al.
patent: 5786614 (1998-07-01), Chuang et al.
patent: 5792679 (1998-08-01), Nakato
patent: 5808344 (1998-09-01), Ismail et al.
patent: 5847419 (1998-12-01), Imai et al.
patent: 5877070 (1999-03-01), Goesele et al.
patent: 5891769 (1999-04-01), Liaw et al.
patent: 5906708 (1999-05-01), Robinson et al.
patent: 5906951 (1999-05-01), Chu et al.
patent: 5912479 (1999-06-01), Mori et al.
patent: 5943560 (1999-08-01), Chang et al.
patent: 5963817 (1999-10-01), Chu et al.
patent: 5966622 (1999-10-01), Levine et al.
patent: 5998807 (1999-12-01), Lustig et al.
patent: 6013134 (2000-01-01), Chu et al.
patent: 6033974 (2000-03-01), Henley et al.
patent: 6033995 (2000-03-01), Muller
patent: 6058044 (2000-05-01), Sugiura et al.
patent: 6059895 (2000-05-01), Chu et al.
patent: 6074919 (2000-06-01), Gardner et al.
patent: 6096590 (2000-08-01), Chan et al.
patent: 6103559 (2000-08-01), Gardner et al.
patent: 6107653 (2000-08-01), Fitzgerald
patent: 6111267 (2000-08-01), Fischer et al.
patent: 6117750 (2000-09-01), Bensahel et al.
patent: 6130453 (2000-10-01), Mei et al.
patent: 6133799 (2000-10-01), Favors, Jr. et al.
patent: 6140687 (2000-10-01), Shimomura et al.
patent: 6143636 (2000-11-01), Forbes et al.
patent: 6153495 (2000-11-01), Kub et al.
patent: 6154475 (2000-11-01), Soref et al.
patent: 6160303 (2000-12-01), Fattaruso
patent: 6162688 (2000-12-01), Gardner et al.
patent: 6184111 (2001-02-01), Henley et al.
patent: 6191007 (2001-02-01), Matsui et al.
patent: 6191432 (2001-02-01), Sugiyama et al.
patent: 6194722 (2001-02-01), Fiorini et al.
patent: 6204529 (2001-03-01), Lung et al.
patent: 6207977 (2001-03-01), Augusto
patent: 6210988 (2001-04-01), Howe et al.
patent: 6218677 (2001-04-01), Broekaert
patent: 6232138 (2001-05-01), Fitzgerald et al.
patent: 6235567 (2001-05-01), Huang
patent: 6242324 (2001-06-01), Kub et al.
patent: 6249022 (2001-06-01), Lin et al.
patent: 6251755 (2001-06-01), Furukawa et al.
patent: 6261929 (2001-07-01), Gehrke et al.
patent: 6266278 (2001-07-01), Harari et al.
patent: 6271551 (2001-08-01), Schmitz et al.
patent: 6271726 (2001-08-01), Fransis et al.
patent: 6291321 (2001-09-01), Fitzgerald
patent: 6313016 (2001-11-01), Kibbel et al.
patent: 6316301 (2001-11-01), Kant
patent: 6323108 (2001-11-01), Kub et al.
patent: 6329063 (2001-12-01), Lo et al.
patent: 6335546 (2002-01-01), Tsuda et al.
patent: 6339232 (2002-01-01), Takagi
patent: 6350993 (2002-02-01), Chu et al.
patent: 6368733 (2002-04-01), Nishinaga
patent: 6372356 (2002-04-01), Thornton et al.
patent: 6399970 (2002-06-01), Kubo et al.
patent: 6403975 (2002-06-01), Brunner et al.
patent: 6407406 (2002-06-01), Tezuka
patent: 6425951 (2002-07-01), Chu et al.
patent: 6429061 (2002-08-01), Rim
patent: 6521041 (2003-02-01), Wu et al.
patent: 6555839 (2003-04-01), Fitzgerald
patent: 6559021 (2003-05-01), Houghton et al.
patent: 6770134 (2004-08-01), Maydan et al.
patent: 7060632 (2006-06-01), Fitzgerald et al.
patent: 2001/0003269 (2001-06-01), Wu et al.
patent: 2001/0003364 (2001-06-01), Sugawara et al.
patent: 2002/0024395 (2002-02-01), Akatsuka et al.
patent: 2002/0043660 (2002-04-01), Yamazaki et al.
patent: 2002/0068393 (2002-06-01), Fitzgerald et al.
patent: 2002/0072130 (2002-06-01), Cheng et al.
patent: 2002/0096717 (2002-07-01), Chu et al.
patent: 2002/0100942 (2002-08-01), Fitzgerald et al.
patent: 2002/0123167 (2002-09-01), Fitzgerald
patent: 2002/0123183 (2002-09-01), Fitzgerald
patent: 2002/0123197 (2002-09-01), Fitzgerald et al.
patent: 2002/0125471 (2002-09-01), Fitzgerald et al.
patent: 2002/0125497 (2002-09-01), Fitzgerald
patent: 2002/0140031 (2002-10-01), Rim
patent: 2002/0168864 (2002-11-01), Cheng et al.
patent: 2002/0197803 (2002-12-01), Leitz et al.
patent: 2003/0003679 (2003-01-01), Doyle et al.
patent: 2003/0013323 (2003-01-01), Hammond et al.
patent: 2003/0025131 (2003-02-01), Lee et al.
patent: 2003/0057439 (2003-03-01), Fitzgerald
patent: 2003/0139000 (2003-07-01), Bedell et al.
patent: 41 01 167 (1992-07-01), None
patent: 0 514 018 (1992-11-01), None
patent: 0 587 520 (1994-03-01), None
patent: 0 683 522 (1995-11-01), None
patent: 0 828 296 (1998-03-01), None
patent: 0 829 908 (1998-03-01), None
patent: 0 838 858 (1998-04-01), None
patent: 1 020 900 (2000-07-01), None
patent: 1 174 928 (2002-01-01), None
patent: 2 701 599 (1993-09-01), None
patent: 2 342 777 (2000-04-01), None
patent: 4-307974 (1992-10-01), None
patent: 04-307974 (1992-10-01), None
patent: 5-166724 (1993-07-01), None
patent: 6-177046 (1994-06-01), None
patent: 6-244112 (1994-09-01), None
patent: 6-252046 (1994-09-01), None
patent: 07-094420 (1995-04-01), None
patent: 7-094420 (1995-04-01), None
patent: 07-106446 (1995-04-01), None
patent: 7-106446 (1995-04-01), None
patent: 7-240372 (1995-09-01), None
patent: 10-270685 (1998-10-01), None
patent: 11-233744 (1999-08-01), None
patent: 2000-031491 (2000-01-01), None
patent: 2000-021783 (2000-08-01), None
patent: 2001-319935 (2001-11-01), None
patent: 2002-076334 (2002-03-01), None
patent: 2002-164520 (2002-06-01), None
patent: 2002-289533 (2002-10-01), None
patent: 98/59365 (1998-12-01), None
patent: 99/53539 (1999-10-01), None
patent: 00/48239 (2000-08-01), None
patent: 00/54338 (2000-09-01), None
patent: 01/22482 (2001-03-01), None
patent: 01/22482 (2001-03-01), None
patent: 01/54202 (2001-07-01), None

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