Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate
Reexamination Certificate
2006-06-13
2006-06-13
Kebede, Brook (Department: 2823)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
By reaction with substrate
Reexamination Certificate
active
07060632
ABSTRACT:
Methods for fabricating multi-layer semiconductor structures including strained material layers using a minimum number of process tools and under conditions optimized for each layer. Certain regions of the strained material layers are kept free of impurities that can interdiffuse from adjacent portions of the semiconductor. When impurities are present in certain regions of the strained material layers, there is degradation in device performance. By employing semiconductor structures and devices (e.g., field effect transistors or “FETs”) that have the features described, or are fabricated in accordance with the steps described, device operation is enhanced.
REFERENCES:
patent: 3935040 (1976-01-01), Mason
patent: 4010045 (1977-03-01), Ruehrwein
patent: 4704302 (1987-11-01), Bruel et al.
patent: 4710788 (1987-12-01), Dambkes et al.
patent: 4969031 (1990-11-01), Kobayashi et al.
patent: 4987462 (1991-01-01), Kim et al.
patent: 4990979 (1991-02-01), Otto
patent: 4997776 (1991-03-01), Harame et al.
patent: 5013681 (1991-05-01), Godbey et al.
patent: 5155571 (1992-10-01), Wang et al.
patent: 5166084 (1992-11-01), Pfiester
patent: 5177583 (1993-01-01), Endo et al.
patent: 5202284 (1993-04-01), Kamins et al.
patent: 5207864 (1993-05-01), Bhat et al.
patent: 5208182 (1993-05-01), Narayan et al.
patent: 5212110 (1993-05-01), Pfiester et al.
patent: 5221413 (1993-06-01), Brasen et al.
patent: 5240876 (1993-08-01), Gaul et al.
patent: 5241197 (1993-08-01), Murakami et al.
patent: 5250445 (1993-10-01), Bean et al.
patent: 5285086 (1994-02-01), Fitzgerald
patent: 5291439 (1994-03-01), Kauffmann et al.
patent: 5298452 (1994-03-01), Meyerson
patent: 5310451 (1994-05-01), Tejwani et al.
patent: 5316958 (1994-05-01), Meyerson
patent: 5346848 (1994-09-01), Grupen-Shemansky et al.
patent: 5374564 (1994-12-01), Bruel
patent: 5399522 (1995-03-01), Ohori
patent: 5413679 (1995-05-01), Godbey
patent: 5424243 (1995-06-01), Takasaki
patent: 5426069 (1995-06-01), Selvakumar et al.
patent: 5426316 (1995-06-01), Mohammad
patent: 5442205 (1995-08-01), Brasen et al.
patent: 5461243 (1995-10-01), Ek et al.
patent: 5461250 (1995-10-01), Burghartz et al.
patent: 5462883 (1995-10-01), Dennard et al.
patent: 5476813 (1995-12-01), Naruse
patent: 5479033 (1995-12-01), Baca et al.
patent: 5484664 (1996-01-01), Kitahara et al.
patent: 5523243 (1996-06-01), Mohammad
patent: 5523592 (1996-06-01), Nakagawa et al.
patent: 5534713 (1996-07-01), Ismail et al.
patent: 5536361 (1996-07-01), Kondo et al.
patent: 5540785 (1996-07-01), Dennard et al.
patent: 5548128 (1996-08-01), Soref et al.
patent: 5572043 (1996-11-01), Shimizu et al.
patent: 5596527 (1997-01-01), Tomioka et al.
patent: 5607876 (1997-03-01), Biegelsen et al.
patent: 5617351 (1997-04-01), Bertin et al.
patent: 5630905 (1997-05-01), Lynch et al.
patent: 5659187 (1997-08-01), Legoues et al.
patent: 5683934 (1997-11-01), Candelaria
patent: 5698869 (1997-12-01), Yoshimi et al.
patent: 5714777 (1998-02-01), Ismail et al.
patent: 5728623 (1998-03-01), Mori
patent: 5739567 (1998-04-01), Wong
patent: 5759898 (1998-06-01), Ek et al.
patent: 5777347 (1998-07-01), Bartelink
patent: 5786612 (1998-07-01), Otani et al.
patent: 5786614 (1998-07-01), Chuang et al.
patent: 5792679 (1998-08-01), Nakato
patent: 5808344 (1998-09-01), Ismail et al.
patent: 5821577 (1998-10-01), Crabbéet al.
patent: 5847419 (1998-12-01), Imai et al.
patent: 5863830 (1999-01-01), Bruel et al.
patent: 5877070 (1999-03-01), Goesele et al.
patent: 5882987 (1999-03-01), Srikrishnan
patent: 5891769 (1999-04-01), Liaw et al.
patent: 5906708 (1999-05-01), Robinson et al.
patent: 5906951 (1999-05-01), Chu et al.
patent: 5912479 (1999-06-01), Mori et al.
patent: 5943560 (1999-08-01), Chang et al.
patent: 5963817 (1999-10-01), Chu et al.
patent: 5966622 (1999-10-01), Levine et al.
patent: 5993677 (1999-11-01), Biasse et al.
patent: 5998807 (1999-12-01), Lustig et al.
patent: 6013134 (2000-01-01), Chu et al.
patent: 6013563 (2000-01-01), Henley et al.
patent: 6020252 (2000-02-01), Aspar et al.
patent: 6030887 (2000-02-01), Desai et al.
patent: 6033974 (2000-03-01), Henley et al.
patent: 6033995 (2000-03-01), Muller
patent: 6058044 (2000-05-01), Sugiura et al.
patent: 6059895 (2000-05-01), Chu et al.
patent: 6074919 (2000-06-01), Gardner et al.
patent: 6096590 (2000-08-01), Chan et al.
patent: 6103559 (2000-08-01), Gardner et al.
patent: 6103597 (2000-08-01), Aspar et al.
patent: 6103599 (2000-08-01), Henley et al.
patent: 6107653 (2000-08-01), Fitzgerald
patent: 6111267 (2000-08-01), Fischer et al.
patent: 6117750 (2000-09-01), Bensahel et al.
patent: 6130453 (2000-10-01), Mei et al.
patent: 6133799 (2000-10-01), Favors, Jr. et al.
patent: 6140687 (2000-10-01), Shimomura et al.
patent: 6143636 (2000-11-01), Forbes et al.
patent: 6153495 (2000-11-01), Kub et al.
patent: 6154475 (2000-11-01), Soref et al.
patent: 6160303 (2000-12-01), Fattaruso
patent: 6162688 (2000-12-01), Gardner et al.
patent: 6162705 (2000-12-01), Henley et al.
patent: 6184111 (2001-02-01), Henley et al.
patent: 6190998 (2001-02-01), Bruel et al.
patent: 6191007 (2001-02-01), Matsui et al.
patent: 6191432 (2001-02-01), Sugiyama et al.
patent: 6194722 (2001-02-01), Fiorini et al.
patent: 6204529 (2001-03-01), Lung et al.
patent: 6207977 (2001-03-01), Augusto
patent: 6210988 (2001-04-01), Howe et al.
patent: 6218677 (2001-04-01), Broekaert
patent: 6225192 (2001-05-01), Aspar et al.
patent: 6232138 (2001-05-01), Fitzgerald et al.
patent: 6235567 (2001-05-01), Huang
patent: 6242324 (2001-06-01), Kub et al.
patent: 6249022 (2001-06-01), Lin et al.
patent: 6251751 (2001-06-01), Chu et al.
patent: 6251755 (2001-06-01), Furukawa et al.
patent: 6261929 (2001-07-01), Gehrke et al.
patent: 6266278 (2001-07-01), Harari et al.
patent: 6271551 (2001-08-01), Schmitz et al.
patent: 6290804 (2001-09-01), Henley et al.
patent: 6291321 (2001-09-01), Fitzgerald
patent: 6303468 (2001-10-01), Aspar et al.
patent: 6323108 (2001-11-01), Kub et al.
patent: 6326667 (2001-12-01), Sugiyama et al.
patent: 6329063 (2001-12-01), Lo et al.
patent: 6335546 (2002-01-01), Tsuda et al.
patent: 6339232 (2002-01-01), Takagi
patent: 6344417 (2002-02-01), Usenko
patent: 6346459 (2002-02-01), Usenko et al.
patent: 6350311 (2002-02-01), Chin et al.
patent: 6350993 (2002-02-01), Chu et al.
patent: 6352909 (2002-03-01), Usenko
patent: 6355493 (2002-03-01), Usenko
patent: 6368733 (2002-04-01), Nishinaga
patent: 6368938 (2002-04-01), Usenko
patent: 6369438 (2002-04-01), Sugiyama et al.
patent: 6372356 (2002-04-01), Thornton et al.
patent: 6372593 (2002-04-01), Hattori et al.
patent: 6372609 (2002-04-01), Aga et al.
patent: 6387829 (2002-05-01), Usenko et al.
patent: 6391740 (2002-05-01), Cheung et al.
patent: 6399970 (2002-06-01), Kubo et al.
patent: 6403975 (2002-06-01), Brunner et al.
patent: 6407406 (2002-06-01), Tezuka
patent: 6410371 (2002-06-01), Yu et al.
patent: 6425951 (2002-07-01), Chu et al.
patent: 6429061 (2002-08-01), Rim
patent: 6445016 (2002-09-01), An et al.
patent: 6448152 (2002-09-01), Henley et al.
patent: 6455397 (2002-09-01), Belford
patent: 6458672 (2002-10-01), Henley et al.
patent: 6475072 (2002-11-01), Canaperi et al.
patent: 6489639 (2002-12-01), Hoke et al.
patent: 6514836 (2003-02-01), Belford
patent: 6515335 (2003-02-01), Christiansen et al.
patent: 6524935 (2003-02-01), Canaperi et al.
patent: 6534381 (2003-03-01), Cheung et al.
patent: 6555839 (2003-04-01), Fitzgerald et al.
patent: 6559021 (2003-05-01), Houghton et al.
patent: 6573126 (2003-06-01), Cheng et al.
patent: 6583015 (2003-06-01), Fitzgerald et al.
patent: 6583437 (2003-06-01), Mizuno et al.
patent: 6591321 (2003-07-01), Arimilli et al.
patent: 6593191 (2003-07-01), Fitzgerald
patent: 6593625 (2003-07-01), Mooney et al.
patent: 6596610 (2003-07-01), Kuwabara et al.
patent: 6597016 (2003-07-01), Yuki et al.
patent: 6602613 (2003-08-01), Fitzgerald
patent: 6603156 (2003-08-01), Rim
patent: 6607948 (2003-08-01), Sugiyama et al.
patent: 6624047 (2003-09-01), Sakaguchi et al.
patent: 6624478 (2003-09-01), Anderson et al.
patent: 6632724 (2003-10-01), Henley et al.
patent: 6635909
Currie Matthew
Fitzgerald Eugene
AmberWave Systems Corporation
Goodwin & Procter LLP
Kebede Brook
LandOfFree
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