Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2008-04-10
2009-12-22
Nhu, David (Department: 2895)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C438S009000, C438S238000, C438S381000, C438S742000, C257SE21170, C257SE21304, C257SE21311, C257SE21585, C257SE21646
Reexamination Certificate
active
07635648
ABSTRACT:
A method for fabricating dual material gate structures in a device is provided. The dual material gate structures have different gate electrode materials in different regions of the device. In one embodiment, the method includes providing a substrate having a patterned first gate electrode and a patterned first gate dielectric layer disposed on the substrate, removing a portion of the first gate electrode from the substrate to define a trench on the substrate, and filling the trench to form a second gate electrode.
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Ku Victor
Peidous Igor
Piccirillo Joe
Applied Materials Inc.
Nhu David
Patterson & Sheridan LLP
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