Etching a substrate: processes – Gas phase etching of substrate – Application of energy to the gaseous etchant or to the...
Reexamination Certificate
2005-01-04
2005-01-04
Goudreau, George A. (Department: 1763)
Etching a substrate: processes
Gas phase etching of substrate
Application of energy to the gaseous etchant or to the...
C216S076000, C216S080000, C438S714000, C438S715000
Reexamination Certificate
active
06838012
ABSTRACT:
Methods of etching dielectric materials in a semiconductor processing apparatus use a thick silicon upper electrode that can be operated at high power levels for an extended service life.
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Burns Doane , Swecker, Mathis LLP
Goudreau George A.
Lam Research Corporation
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