Methods for etching dielectric materials

Etching a substrate: processes – Gas phase etching of substrate – Application of energy to the gaseous etchant or to the...

Reexamination Certificate

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C216S076000, C216S080000, C438S714000, C438S715000

Reexamination Certificate

active

06838012

ABSTRACT:
Methods of etching dielectric materials in a semiconductor processing apparatus use a thick silicon upper electrode that can be operated at high power levels for an extended service life.

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