Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2006-03-28
2006-03-28
Barreca, Nicole (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C430S313000, C430S317000, C216S037000, C216S067000, C438S694000, C438S695000
Reexamination Certificate
active
07018780
ABSTRACT:
A method for controlling a removal of photoresist material from a semiconductor substrate is provided. The method includes providing the semiconductor substrate having a photoresist mask formed thereon. The method also includes forming a conformal layer of polymer over the photoresist mask and a portion of the semiconductor substrate not covered by the photoresist mask while concurrently removing a portion of the conformal layer of polymer. The thickness of the conformal layer of polymer on each region of the semiconductor substrate is set to vary depending on a removal rate of the conformal layer of polymer in each region of the semiconductor substrate.
REFERENCES:
patent: 6316169 (2001-11-01), Vahedi et al.
patent: 6372634 (2002-04-01), Qiao et al.
patent: 6653058 (2003-11-01), Vahedi et al.
patent: 6670265 (2003-12-01), Wang et al.
Braly Linda B.
Vahedi Vahid
Barreca Nicole
Lam Research Corporation
Martine & Penilla & Gencarella LLP
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