Methods, apparatuses, and systems for fabricating three...

Details Methods, apparatuses, and systems for fabricating three... Methods, apparatuses, and systems for fabricating three...

2007-12-17

2011-10-11

Culbert, Roberts (Department: 1716)

Coating processes

Coating by vapor, gas, or smoke

C438S689000, C216S017000

Reexamination Certificate

active

08034409

ABSTRACT:
The present invention pertains to methods, apparatuses, and systems for fabricating three-dimensional integrated circuits. One embodiment of the method comprises providing a wafer or other substrate having a plurality of through holes. In addition, the method includes supporting the wafer or other substrate with a wafer or other substrate holder mounted in a process chamber. The method further includes generating a pressure differential between the front side of the wafer or other substrate and the back side of the wafer or other substrate while the wafer or other substrate is supported on the wafer or other substrate holder so that the pressure differential causes fluid flow through the through holes. Also, the method includes establishing process conditions in the process chamber for at least one process to fabricate integrated circuits. Embodiments of a system and embodiments of an apparatus according to the present invention are also presented.

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