Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2008-12-05
2011-10-18
Lauchman, Layla (Department: 2877)
Image analysis
Applications
Manufacturing or product inspection
C382S144000, C382S145000, C356S237200, C356S237500
Reexamination Certificate
active
08041106
ABSTRACT:
Methods and systems for detecting defects on a reticle are provided. One method includes printing a single die reticle in first areas of a wafer using different values of a parameter of a lithography process and at least one second area using a nominal value of the parameter. The method also includes acquiring first images of the first areas and second image(s) of the at least one second area. In addition, the method includes separately comparing the first images acquired for different first areas to at least one of the second image(s). The method further includes detecting defects on the reticle based on first portions of the first images in which variations in the first images compared to the at least one second image are greater than second portions of the first images and the first portions that are common to two or more of the first images.
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Chia Wee-Teck
Chin Aaron Geurdon
Duffy Brian
Malik Irfan
Tung-Sing Pak Patrick
KLA-Tencor Corp.
Lauchman Layla
Mewherter Ann Marie
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