Coating processes – Direct application of electrical – magnetic – wave – or... – Plasma
Reexamination Certificate
2011-06-14
2011-06-14
Meeks, Timothy H (Department: 1715)
Coating processes
Direct application of electrical, magnetic, wave, or...
Plasma
C118S7230AN
Reexamination Certificate
active
07959984
ABSTRACT:
In a plasma processing system, a method of reducing byproduct deposits on a set of plasma chamber surfaces of a plasma processing chamber is disclosed. The method includes providing a deposition barrier in the plasma processing chamber, the deposition barrier is configured to be disposed in a plasma generating region of the plasma processing chamber, thereby permitting at least some process byproducts produced when a plasma is struck within the plasma processing chamber to adhere to the deposition barrier and reducing the byproduct deposits on the set of plasma processing chamber surfaces.
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Bailey III Andrew D.
Lohokare Shrikant P.
Burkhart Elizabeth
IP Strategy Group, P.C.
Lam Research Corporation
Meeks Timothy H
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