Methods and apparatuses for singulation of microelectromechanica

Details Methods and apparatuses for singulation of microelectromechanica Methods and apparatuses for singulation of microelectromechanica

1997-04-18

1999-07-13

Niebling, John F.

Semiconductor device manufacturing: process

Semiconductor substrate dicing

438462, 438464, H01L 21301, H01L 2146, H01L 2178

Patent

active

059239956

ABSTRACT:
Disclosed are methods and apparatuses that allow the dicing of wafers containing microelectromechanical systems into singulated individual dies that is economic to use and leaves substantially no residue on the surface of the individual dies. A method for packaging the dice singulated according to the present invention is also disclosed.

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