4. Metal fusion bonding
  5. Process
  6. Plural joints

Ranjan J. Mathew

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Apparatus and method extending flip-chip pad structures for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
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Apparatus and method extending flip-chip pad structures for...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Apparatus and method for substantially stress-free...

Liquid crystal cells – elements and systems – Nominal manufacturing methods or post manufacturing...
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Bump structure for reflow bonding of IC devices

Metal fusion bonding – Process – Critical work component – temperature – or pressure
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Chip scale package and method for manufacture thereof

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Profile ID: LFUS-PAI-P-613902

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