Methods and apparatuses for providing stacked-die devices

Details Methods and apparatuses for providing stacked-die devices Methods and apparatuses for providing stacked-die devices

2007-03-06

2007-03-06

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S686000, C257S777000, C257S787000, C257SE25006, C257SE25013, C257SE25018, C257SE25021, C257SE25027, C257SE23085

Reexamination Certificate

active

10917142

ABSTRACT:
Methods and apparatuses to provide a stacked-die device comprised of stacked sub-packages. For one embodiment of the invention, each sub-package has interconnections formed on the die-side of the substrate for interconnecting to another sub-package. The dies and associated wires are protected by an encapsulant leaving an upper portion of each interconnection exposed. For one embodiment of the invention the encapsulant is a stencil-printable encapsulant and the upper portion of the interconnection is exposed by use of a patterned stencil during application of the encapsulant.

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PCT Search Report mailed Dec. 6, 2005 for PCT/US2005/027103.

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