Methods and apparatuses for clamping and declamping a semiconduc

Details Methods and apparatuses for clamping and declamping a semiconduc Methods and apparatuses for clamping and declamping a semiconduc

1996-06-28

1998-08-11

Wong, Peter S.

Electricity: power supply or regulation systems

Self-regulating

Using a three or more terminal semiconductive device as the...

361234, 279128, G05F 304, H01G 2300, B23B 522

Patent

active

057931925

ABSTRACT:
A method for clamping a wafer to an electrostatic chuck having a substantially resistive dielectric layer disposed thereon. The method includes the step of providing a build-up voltage having a first polarity to a pole of the electrostatic chuck to cause a potential difference to build up between a first region of the substantially resistive dielectric layer and a second region of the wafer that overlies at least a portion of the first region. This potential difference gives rise to a clamping force to clamp the wafer to the electrostatic chuck. The method further includes the step of terminating the build-up voltage when the clamping force substantially reaches a predefined level. There is further included the step of providing a holding voltage to the pole of the electrostatic chuck to substantially maintain the clamping force at the predefined level. This holding voltage has the first polarity and a magnitude that is lower than a magnitude of the build-up voltage. There is further included the step of providing a declamping voltage to the pole of the electrostatic chuck to substantially remove the clamping force, the declamping voltage having a polarity that is opposite to the first polarity.

REFERENCES:
patent: 5117121 (1992-05-01), Watanabe et al.
patent: 5325261 (1994-06-01), Horwitz
patent: 5444597 (1995-08-01), Blake et al.
patent: 5535090 (1996-07-01), Sherman
patent: 5535507 (1996-07-01), Barnes et al.
patent: 5539609 (1996-07-01), Collins et al.
patent: 5573981 (1996-11-01), Sato
patent: 5583737 (1996-12-01), Collins et al.
patent: 5612850 (1997-03-01), Birange et al.

Affiliated with

Also associated with

Rating

Methods and apparatuses for clamping and declamping a semiconduc does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods and apparatuses for clamping and declamping a semiconduc, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and apparatuses for clamping and declamping a semiconduc will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-392444