Methods and apparatus having wafer level chip scale package...

Details Methods and apparatus having wafer level chip scale package... Methods and apparatus having wafer level chip scale package...

2006-09-19

2006-09-19

Smith, Bradley K. (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S026000, C438S127000, C257S417000, C257S788000, C257S792000

Reexamination Certificate

active

07109055

ABSTRACT:
Methods are provided for manufacturing a sensor. The method comprises depositing a sacrificial material at a first predetermined thickness onto a wafer having at least one sense element mounted thereon, the sacrificial material deposited at least partially onto the at least one sense element, forming an encapsulating layer at a second predetermined thickness less than the first predetermined thickness over the wafer and around the deposited sacrificial material, and removing the sacrificial material. Apparatus for a sensor manufactured by the aforementioned method are also provided.

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