Metal fusion bonding – With control means responsive to sensed condition
Reexamination Certificate
2005-03-31
2008-08-05
Stoner, Kiley (Department: 1793)
Metal fusion bonding
With control means responsive to sensed condition
C228S011000, C228S041000
Reexamination Certificate
active
07407081
ABSTRACT:
In a first aspect, a programmable transfer device is provided for transferring conductive pieces to electrode pads of a target substrate. The programmable transfer device includes (1) a transfer substrate; and (2) a plurality of individually addressable electrodes formed on the transfer substrate. Each electrode is adapted to selectively attract and hold a conductive piece during transfer of the conductive piece to an electrode pad of a target substrate. Numerous other aspects are provided.
REFERENCES:
patent: 4857482 (1989-08-01), Saito et al.
patent: 5217597 (1993-06-01), Moore et al.
patent: 5257395 (1993-10-01), Li
patent: 5631803 (1997-05-01), Cameron et al.
patent: 5765744 (1998-06-01), Tatumi et al.
patent: 5814885 (1998-09-01), Pogge et al.
patent: 5839641 (1998-11-01), Teng
patent: 5841194 (1998-11-01), Tsukamoto
patent: 6056190 (2000-05-01), Foulke et al.
patent: 6409073 (2002-06-01), Kaskoun et al.
patent: 6492715 (2002-12-01), Markovich et al.
patent: 6696347 (2004-02-01), Hikita et al.
patent: 6889886 (2005-05-01), Hazeyama et al.
patent: 6926188 (2005-08-01), Hazeyama et al.
patent: 2001/0045524 (2001-11-01), Fudoji et al.
patent: 2003/0106925 (2003-06-01), Bednarz et al.
patent: 0 840 368 (1998-05-01), None
patent: 01 045135 (1989-02-01), None
patent: 05-047839 (1993-02-01), None
patent: 05 047839 (1993-02-01), None
patent: 07-283521 (1995-10-01), None
patent: 07 283521 (1995-10-01), None
Bjorkman Claes H.
Collins Kenneth S.
Miu Thomas
Rice Michael R.
Zhao Jun
Applied Materials Inc.
Dugan & Dugan
Stoner Kiley
LandOfFree
Methods and apparatus for transferring conductive pieces... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods and apparatus for transferring conductive pieces..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and apparatus for transferring conductive pieces... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3993431