Methods and apparatus for thinning, testing and singulating...

Details Methods and apparatus for thinning, testing and singulating... Methods and apparatus for thinning, testing and singulating...

2009-11-12

2011-12-13

Arora, Ajay K (Department: 2892)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

C438S460000, C438S465000, C438S017000

Reexamination Certificate

active

08076216

ABSTRACT:
A wafer translator is provided with a patterned layer of wafer bonding thermoset plastic and is removably attached with a wafer so as to form a wafer/wafer translator pair. The wafer translator acts as a mechanical support during a thinning process as well as during a wafer dicing operation. The singulated integrated circuits are then removed from the wafer translator. In some embodiments, wafer level testing of the integrated circuits on the wafer is performed subsequent to the wafer thinning process but before the wafer and wafer translator are separated. In other embodiments, wafer level testing of the integrated circuits on the wafer is performed subsequent to the wafer dicing operation but before the diced wafer and wafer translator are separated.

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