Methods and apparatus for sputtering with rotating magnet sputte

Details Methods and apparatus for sputtering with rotating magnet sputte Methods and apparatus for sputtering with rotating magnet sputte

1996-10-02

1998-11-03

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429819, 2042982, 20429826, C23C 1434

Patent

active

058303278

ABSTRACT:
A magnetron sputtering source for forming a sputtered film on a substrate in a magnetron sputtering apparatus includes a target having a surface from which material is sputtered and a magnet assembly that is rotatable about an axis of rotation with respect to the target. The magnet assembly produces on the target an erosion profile that is calculated to yield a desired depositional thickness distribution and inventory. A method for configuring the rotatable magnet assembly includes the steps of determining an optimal erosion profile that yields the desired depositional thickness distribution and inventory, determining a plasma track on the surface of the target that produces an acceptable approximation to the optimal erosion profile, and determining a magnet structure that produces the plasma track.

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patent: 5314597 (1994-05-01), Harra
patent: 5320728 (1994-06-01), Tepman

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