Methods and apparatus for measuring thickness of etching...

Details Methods and apparatus for measuring thickness of etching... Methods and apparatus for measuring thickness of etching...

2008-07-23

2010-10-19

Toatley, Jr., Gregory J (Department: 2877)

Optics: measuring and testing

Dimension

Thickness

Reexamination Certificate

active

07817289

ABSTRACT:
A method of determining a thickness of a residue layer on a substrate includes: (1) taking a first set of optical scatterometry measurements on the substrate after an etching procedure; (2) taking a second set of optical scatterometry measurements on the substrate after a post-etch cleaning procedure; (3) calculating a difference measurement between the first set and second set of optical scatterometry measurements; (4) determining an initial thickness measurement of the residue layer based on the difference measurement by applying a first dispersion model; and (5) adjusting the initial thickness measurement by applying a second dispersion model based on a material composition of the residue layer. Numerous other aspects are provided.

REFERENCES:
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patent: WO 2009/014698 (2009-01-01), None
International Search Report and Written Opinion of International Application No. PCT/US08/08906 mailed Sep. 29, 2008.
Thony et al., “Evaluation of Scatterometry Tools for Integrated Metrology”, ST Microelectronics, entire document http://www.imec.be/uv2litho/SEMI03.pdj, Nov. 30, 2004.

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