Methods and apparatus for determining scrubber brush pressure

Details Methods and apparatus for determining scrubber brush pressure Methods and apparatus for determining scrubber brush pressure

2007-06-12

2007-06-12

Carrillo, Sharidan (Department: 1746)

Cleaning and liquid contact with solids

Processes

Using solid work treating agents

C015S077000, C015S088300, C015S088400, C015S102000, C134S05600D, C134S0570DL, C134S0580DL, C134S042000

Reexamination Certificate

active

11304120

ABSTRACT:
In a scrubber adapted to clean a semiconductor wafer, the torque of a brush rotation motor is monitored while a scrubber brush is in contact with the wafer and is being rotated by the motor. The position of the brush relative to the wafer may be adjusted based on the monitored torque to regulate the pressure applied to the wafer by the brush. Open loop positioning or closed loop control may be employed.

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